TFL Tech Inc. Named Gold Sponsor of the 2026 CU Growth & Innovation Summit

We are excited to welcome TFL Tech Inc. as a Gold Sponsor of the 2026 CU Growth & Innovation Summit, taking place February 9–11, 2026, in Oak Brook, Illinois.

Founded in 1998 as Trust Fintech Limited, TFL Tech Inc. expanded into the U.S. market in 2024 and brings a deep legacy of delivering advanced, AI-enabled SaaS banking solutions to credit unions, banks, and financial institutions worldwide. With operations across 20+ countries, the company is known for its trusted core banking platforms, loan origination systems, and anti-money laundering (AML) tools — all backed by robust compliance credentials including Microsoft Gold Partner, CMMi Level 5, and ISO 27001 certifications.

TFL Tech’s global delivery centers in North America, India, and the UK provide highly reliable and secure platforms that support digital transformation and operational efficiency for financial institutions at scale. Their long-standing commitment to innovation and security makes them a natural fit for the CU Growth & Innovation community.

We look forward to engaging with the TFL Tech team as they bring their thought leadership, expertise, and future-ready solutions to the Summit.

To Learn More about TFL Tech Inc.
Visit here: tfltechinc.com

REGISTER TODAY to join us in Oak Brook, IL from February 9 to 11, 2026

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